Microchip Trumpets Lead-Free Flip Chips, Shares Hike

Microchip Technology’s (NASDAQ: MCHP) Radiation-Tolerant (RT) RTG4™ Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products.

In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.

RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets.

MCHP shares jumped $1.23, or 1.6%, to $77.12.